PROJECTS
For UV laser cutting and grooving(355nm, or pico) for Semiconductor/ LED/Display industries especially CIG(CMOS,CCD)wafers, Metal bumped Si wafers, Vertical line, etc, one of Engineers’ interest is to fin the good alternative of current expensive protective coating solution.
Molding related, including mold chase, cavity bar, spares parts and etc.
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Offers new design project, improvement project and testing project for mold chase based on over 20 years experience.
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R&D
We had experienced in many fields and it can be applied into developing new design as customer’s requested. Furthermore, we solve problems with customers together and offer the most appropriate solution.
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Features: High precision processing, Fast delivery, High quality, Customized
Synthetic Diamond Dicing Blades & Diamond Dressing Boards
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For Dicing Semiconductor Chip Board and silicon wafers
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Offers a wide rang of Dressing Boards for different applications. You can choose from different mesh sizes, abrasives and dimensions to meet your needs.
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Features: Longer life, Improved cutting quality, Customized
We also provide customized service as customers requested based on the purpose of our company, STI, “ Service, Trust, Integration”
You tell us your needs and STI will find the best solution to you.
Here are few examples.